Bin/Defect Map defect analysis

Bin/Defect Map defect analysis is mainly used for Bin and Defect analysis of CP measured data. The system supports analysis by Lot and Wafer. Supports query and analysis of Bin and Defect data based on conditions such as time range, product, process route, process, process step, and inspection equipment.

Can display Bin/Defect Map according to single wafer/multiple wafers/Lot, support displaying the actual size of Defect on Defect Map, support the link between Defect actual picture and Defect point on Map, and support the summary and conditional query of Bin/Defect original data export to Excel.

Provide Bin and Defect Map overlay display analysis, and provide multiple condition query function, support Wafer Mapping map zoom in, zoom out, rotate, copy and other functions.